Electronics Heat Dissipation
Heat flows through all materials from regions where they are hot to regions where they are cold. One of the hottest places inside today’s computers is in the central processing unit (CPU). This energy has to ultimately be transferred to the air in the surrounding environment and the rate of heat transfer is proportional to the amount of area that is hot. The key is then to minimize the resistance between the where the heat is generated, deep inside the CPU, and the surrounding air. There are however, many different materials and interfaces in between that impede the transfer of heat, which makes the problem challenging. One project the ASE group works on involves the development of special plastic materials that have low impedance to the flow of heat and therefore can be used help spread the heat in mobile devices allowing them to operate cooler.